| Problem |
Cause |
Reactivity too fast,
quick gel |
Prepolymer abuse from overheating, processing temp too high,
excessive catalyst in curative |
Reactivity too slow,
long gel & demold time |
Processing temp too low, mold temp too low,
curative temp too low, off ratio, poor mixing, inadequate catalyzation |
| Prepolymer viscosity too high |
Prepolymer abuse from overheating, processing
temp too low, moisture in prepolymer |
| Change in NCO – lower than reported |
Moisture in prepolymer, prepolymer abuse
from overheating, beyond shelf life |
| Parts too soft at demold |
Material temp too low, poor mixing, off ratio,
molds too cold, inadequate catalyzation |
| Shrinkage & shrink marks |
Mold temp too low (peak exotherm too far
above mold temp) |
Wet spots
(uncured material) |
Poor mixing, unmixed resin or solvent contamination,
machine malfunction |
| Bubbles or pin holes in finished product |
Moisture in extender, entrained air at mix,
insufficient degassing, pouring technique |
| Fissures or fold marks in finished parts |
Filling mold too slowly, gel time too fast, excess
mold release, excessive amounts of mold release |
| Cracks |
Material selection and/or mold design – contact
ITWC, Inc. |
| Striations |
Machine malfunction, poor mixing, inconsistent
material temps |
| Skins and solids present in prepolymer |
Exposure to moisture |
| Overall poor appearance of finished parts |
Process temp too low, mold temp too low, poor
mixing, dirty molds, contaminated material/mold release |
| Poor Adhesion |
Excessive amounts of mold release, contamination
in mold before or after application of adhesive, improperly applied |
| Parts stick to mold |
Poor mixing, insufficient amount of mold release,
dirty mold, very high mold temp |
Spongy parts
(parts soft at demold but harden as they cool) |
Mold temps too high |